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| Description |
the thermal flow of a device equipped with a thermal bump |
|---|---|
| Source |
self-made, Nextreme Thermal Solutions |
| Date |
20:14, 20 March 2008 (UTC) |
| Author |
Nextreme Thermal Solutions |
| Permission (Reusing this file) |
Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts.
Subject to disclaimers.
|
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 20:14, 20 March 2008 | | 735 × 634 (206 KB) | Kvongunten (talk | contribs) | {{Information |Description = the thermal flow of a device equipped with a thermal bump |Source = self-made, Nextreme Thermal Solutions |Date = ~~~~~ |Author = Nextreme Thermal Solutions |Permission = Permission is granted to copy, distribute and/or modi |
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